Home ﹥ Hot News > Artificial Intelligence > Application > XRM-SSD V24 x Intel's 3.5D heterogeneous integrated package 2026-06-17
Links：https://dollarchip.mystrikingly.com/blog/xrm-ssd-v24-x-intel ...
When this physical perception software layer (XRM-SSD V24) is successfully implemented in Intel's 3.5D heterogeneous integrated package
(Foveros Direct 3D + PowerVia + UCIe) and achieves the aforementioned highly disruptive quantitative performance, it will not only optimize
data for the chip industry, but will directly rewrite the system design rules, computing power limits, and commercial costs of next-generation
high-performance chips (such as Tau-Law architecture and trillion-parameter LLM training chips).
In summary, Intel's 3.5D packaging platform will no longer be just a physical container "gluing chips together," but an "intelligent
life system" dynamically controlled by the physical sensing software (V24) brain and ultra-fast responded by the PowerVia vascular system.
This will enable next-generation computing nodes using this technology to exhibit unparalleled energy efficiency and operational stability
when executing trillion-parameter AI models.
(Foveros Direct 3D + PowerVia + UCIe) and achieves the aforementioned highly disruptive quantitative performance, it will not only optimize
data for the chip industry, but will directly rewrite the system design rules, computing power limits, and commercial costs of next-generation
high-performance chips (such as Tau-Law architecture and trillion-parameter LLM training chips).
In summary, Intel's 3.5D packaging platform will no longer be just a physical container "gluing chips together," but an "intelligent
life system" dynamically controlled by the physical sensing software (V24) brain and ultra-fast responded by the PowerVia vascular system.
This will enable next-generation computing nodes using this technology to exhibit unparalleled energy efficiency and operational stability
when executing trillion-parameter AI models.
